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    The eMMC architecture puts the MMC components (flash memory plus controller) into a small ball grid array (BGA) IC package for use in circuit boards as an embedded non-volatile memory system. This is noticeably different from other versions of MMC as this is not a user-removable card, but rather a permanent attachment to the circuit board. eMMC also does not support the SPI-bus protocol.Almost all mobile phones and tablets use this form of flash for main storage. The latest version of the eMMC standard (JESD84-B51) by JEDEC is version 5.1 released February 2015, with speeds rivaling discrete SATA-based SSDs (400 MB/s).   
JSCJeju Semiconductor is one of the world largest SRAM solutions provider for mobile applications
Since Jeju Semiconductor made a debut to the SRAM (Static Random Access Memory) market in 2001 with 4M SRAM, Jeju Semiconductor continued implementing full lineup of low power SRAM products through 1M, 2M, 4M to 8M SRAM.
 
Density Stack Part number Vcc Speed Package Type Type Download
32Gb 4-stack JSMC32DUS1AVAEA-H2 3.3V HS200 153B (11.5mm x 13 mm) TLC NULL
32Gb 4-stack JSMC32DUD1HYAEA-H4 3.3V HS400 153B (11.5mm x 13 mm) MLC NULL
32Gb 4-stack JSMC32DUA1HYAEA-H4 3.3V HS400 153B (11.5mm x 13 mm) MLC NULL
16Gb 2-stack JSMC16BUS1AVAEA-H2 3.3V HS200 153B (11.5mm x 13 mm) TLC NULL
16Gb 2-stack JSMC16BUD1HYAEA-H4 3.3V HS400 153B (11.5mm x 13 mm) MLC NULL
16Gb 2-stack JSMC16BUA1HYAEA-H4 3.3V HS400 153B (11.5mm x 13 mm) MLC NULL
8Gb 1-stack JSMC08AUS1AVAEA-H2 3.3V HS200 153B (11.5mm x 13 mm) TLC NULL
8Gb 1-stack JSMC08AUD1HYAEA-H4 3.3V HS400 153B (11.5mm x 13 mm) MLC NULL
8Gb 1-stack JSMC08AUA1HYAEA-H4 3.3V HS400 153B (11.5mm x 13 mm) MLC NULL
4Gb 1-stack JSMC04AUM1AVAED-H4 3.3V HS400 153B (8.0mm x 10 mm) TLC NULL
4Gb 1-stack JSMC04AUA1AVAEA-H4 3.3V HS400 153B (8.0mm x 10 mm) TLC NULL
4Gb 1-stack JSMC04AUA1HYAEA-H4 3.3V HS400 153B (11.5mm x 13 mm) MLC NULL
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