LM5025A Die |
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有源钳位电压模式 PWM 控制器 |
Fabrication Attributes | General Die Information | |||
Physical Die Identification |
LM5025A | Bond Pad Opening Size (min) | 91μm x 91μm | |
Die Step | A | Bond Pad Metalization | Al_ 0.5%Cu | |
Physical Attributes | Passivation | PECVDOX+NITRIDE | ||
Wafer Diameter | 150mm | Back Side Metal | BARE BACK | |
Die Size (Drawn) | 2286μm x 2540μm 90.0mils x 100.0mils | Back Side Connection | Floating | |
Thickness | 254μm Nominal | |||
Min Pitch | 167μm Nominal | |||
Special Assembly Requirements: | ||||
Note: Actual die size is rounded to the nearest micron. | ||||
LM5025 MDC MWC ACTIVE CLAMP VOLTAGE MODE PWM CONTROLLER |