Bare Die/Wafer - SRAM_SRAM chip_MRAM_PSRAM_everspin_netsol_JSC

A wafer, also called a slice or substrate, is a thin slice of semiconductor material, such as a crystalline silicon, used in electronics for the fabrication of integrated circuits and in photovoltaics for conventional, wafer-based solar cells. The wafer serves as the substrate for microelectronic devices built in and over the wafer and undergoes many microfabrication process steps such as doping or ion implantation, etching, deposition of various materials, and photolithographic patterning. Finally the individual microcircuits are separated (dicing) and packaged.


LM5025A Die
Active Clamp Voltage Mode PWM Controller

DIE/WAFER CHARACTERISTICS

Fabrication Attributes		General Die Information
Physical Die Identification	LM5025A	Bond Pad Opening Size (min)	91μm x 91μm
Die Step	A	Bond Pad Metalization	Al_ 0.5%Cu
Physical Attributes		Passivation	PECVDOX+NITRIDE
Wafer Diameter	150mm	Back Side Metal	BARE BACK
Die Size (Drawn)	2286μm x 2540μm 90.0mils x 100.0mils	Back Side Connection	Floating
Thickness	254μm Nominal
Min Pitch	167μm Nominal
Special Assembly Requirements:
Note: Actual die size is rounded to the nearest micron.

LM5025 MDC MWC ACTIVE CLAMP VOLTAGE MODE PWM CONTROLLER

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